[Features] 1-liquid room-temperature curing paste silicone with high thermal conductivity. Just apply it between the CPU and heatsink to improve thermal conductivity and fix it. It has moderate viscosity and excellent workability.
[Use] Heat dissipation of semiconductor devices such as power transistors, ICs, and CPUs. Filling between transistors, rectifiers, thyristors, etc. and heat sinks.
【specification】 Color: White Capacity (g): 20 Specific Gravity: 2.26 Volume resistivity (Ω cm): 1.0 x 10 [[15th power]]
[Specification 2] Operating temperature range: -40 to 150°C Viscosity (when paste): 85 to 108 Pa･s Thermal conductivity: 0.92W/m・k
