Taica Paste Thermal Conductive Gel DP Series DP-100 6.5W/mK

[Features] ● Extremely soft thermal conductive gel. ●Achieves high thermal conductivity and exhibits excellent heat dissipation effect. ●With its excellent flexibility and adhesiveness, it adheres to uneven surfaces and does not create an air layer on the contact surface. ●Excellent electrical insulation and flame resistance. ●Can be used in a wide temperature range. ●Because the molecules are gently crosslinked, it has a structure that makes it difficult for “sagging” and “vaporization” to occur.

[Applications] ● Heat dissipation inside the PC (CPU, board, etc.). ●Heat dissipation from power transistors and power supply components. ●Heat dissipation of heat-generating semiconductor elements such as electronic devices. ●A gap around a heating element such as a high-density semiconductor element. ● Top, side and lead wires of heating elements such as ICs. ●Exothermic areas where it is difficult to attach the sheet. ●Places where there is not enough space to install the heat-conducting material.

[Specifications] - Operating temperature range (°C): -40 to 200 - Dielectric strength (kV/mm): 5 - Volume resistivity (Ω cm): 5.9 x 10[UE13] - Specific gravity: 2.8 Capacity (cc): 30 Hardness (consistency) (1/10mm, unmixed): 51

[Specification 2] Thermal conductivity: 6.5 W/m K (in-house measurement method), 2.1 W/m K (hot wire method)

[Material/Finish] Silicone gel, thermally conductive filler

[Set contents/accessories]
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[Caution] ● Before using the product, conduct a preliminary test to confirm its suitability for the intended use. ● Developed for general industrial use. Never use it for medical implant products. ●Various data are not guaranteed values. The contents of this manual are subject to change without notice due to performance improvements, specification changes, etc. ●Oil derived from silicone raw materials may ooze out depending on usage conditions. ●Contains low-molecular-weight siloxane.