ENGINEER Superior RMA no-clean solder 0.6mm

[Features]
●Since the flux residue is completely non-corrosive, there is no need to clean the board after soldering.
●Long-lasting activity, excellent spreadability, and solder wettability enable faster work.
●The residue is non-hygroscopic and has excellent electrical insulation.
●Excellent wettability with good long-lasting activity.
●Organic amine-based special active rosin (non-chlorine type) is used.
●Complies with JIS-AA class and MIL-RMA standards.

[Use]
● For copper and copper alloy precision substrates.

【specification】
- Wire diameter (mm): 0.6
●Length (m): 5.6

[Specification 2]
Melting point: 183-190℃
● Flux: JIS-AA grade

[Material/Finish]
- Alloy composition (tin: 60%, lead: 40%)

[Set contents/accessories]
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【Note】
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