[Features]● An ultra-high output 300W high heat capacity desoldering device with a built-in vacuum pump. ●By overwhelming power, it is possible to remove solder from boards with high heat capacity and high heat dissipation. ●Reliable suction is achieved by the valve function, and solder clogging has been reduced by design improvements. ●By using the included wrench, troublesome nozzle replacement can be done quickly and safely.
[Applications] ●Recommended for desoldering work on boards with high heat capacity and high heat dissipation.
[Specifications] - Power supply (V): 100 - Power consumption (W): 320 - Total length (mm): 183 - Set temperature (°C): 350 - 500 - Vacuum generation method: Double cylinder diaphragm pump - Compatible nozzle: N60 Series ●Body dimensions (mm) depth: 264 ●Body dimensions (mm) height: 137 ●Body dimensions (mm) width: 166 ●Cord length (m): 1.2 ●Cord length (m): 1.2
[Specification 2] ● Control temperature: No-load ripple temperature ±5°C ● Output: 24 V ● Vacuum generation method: Double cylinder diaphragm pump ● Ultimate vacuum pressure: 80 kPa ● Suction flow rate: 15 L/min ● Compatible nozzle: N60 series
[Material/Finish] -
[Set Contents/Accessories] ●Station body ●Iron section (FR4003-81) (nozzle φ1.0 included) ●Iron stand (FH400-82) ●Power cord 1.2m (B2387) ●Tool box (C5011)
